Maximum Performance - MX series modules are targeted for high performance platforms where flexibility and scalability is utmost important. These wireless modules are based on hosted architecture where a capable MCU/MPU running operating systems like Linux, Windows or Android is used. In this series of products, TCP/IP networking stack, wireless protocol stacks, security supplicant and all the application APIs will run in external host. Major advantage with this architecture is the user’s ability to leverage the existing code libraries from the open source which dramatically reduces the time to market and cost of the development of a high end product.
Ultra Low Power
Very High Throughputs
Ultra Small Size
802.11 ac/a/b/g/n
Multi Protocol (Combo)
Modules in this series can give through-puts (data rate) up to 300mbps (with 1x1 11acabgn), and supports Station mode, Access Point & Wi-Fi Direct with protocols WPA, WPA2, WPS, WEP and Enterprise security. These modules come with SDIO, USB, SPI and UART interfaces and option to select with or without antenna. These fully certified (FCC, IC, CE) modules supporting Mutli-protocol (WiFi + BT + BLE), Multi-band (dual band 802.11ac/a/b/g/n) and single-band (802.11 b/g/n)gives complete flexibility and scalability to the user in developing applications in IoT and IIoT (M2M).
| Module | Protocols | Antenna | Dimensions | Certification |
|---|---|---|---|---|
WM828CC6 |
802.11 ac/a/b/g/n + Bluetooth 4.2/BLE | On-board u.Fl connector | 13 mm x 11 mm x 1.86 mm | On going |
W2CBW0015 |
802.11 b/g/n + BT 3.0 + HS | RF Pad | 9.5 mm x 9.5 mm x 1.4 mm | FCC, CE, IC |
| Module | Protocols | Antenna | Dimensions | Certification |
|---|---|---|---|---|
WM825B00 |
802.11 b/g/n 20MHz | On board Chip + u.Fl connector | 12.5 mm x 16 mm x 1.76 mm | FCC, CE, IC |
W2CBW0015W |
802.11 b/g/n 20 & 40 MHz | RF Pad | 9.5 mm x 9.5 mm x 1.4 mm | FCC, CE, IC |