Overview
WM825B00 from Wi2Wi's Maximum Performance series is a 1x1 SISO, Single-Band Hosted Wi-Fi module. This module is integrated with a chip antenna and an u.Fl connector and supports antenna diversity. It is a highly integrated Wireless LAN (WLAN) subsystem with MAC, baseband, RF front-end, PA, crystal, switch, filter and OTP memory for calibration data and MAC address storage. This 802.11 bgn module offers SDIO 2.0 and USB 2.0 host interfaces for easy connection to all leading 32 bit processors running Linux operating systems. This ultra-small wifi module, WM825B00 gives Industry's Best in class performance for high throughput (HT), high transmit power (TXPWR), excellent receive sensitivity (RSSI) and supports deep sleep and standby modes for low power operation. The highly integrated WM825B00 provides all necessary circuitry for a complete 2.4 GHz, IEEE 802.11 b/g/n wi-fi connectivity solutions requiring no other external components other than power supply. WM825B00 is FCC, CE and IC certified and comes in various operating temperatures.
Features
- Small size WLAN module with footprint: 12.5 mm x 16 mm x 1.76 mm
- IEEE 802.11b/g/n Single-Band Wi-Fi, 1x1 SISO
- 20 MHz Channel Bandwidth
- High Throughput (HT) up to 50 Mbps
- Support for Station/Client Mode, Access Point Mode, and Wi-Fi Direct Mode
- Onboard Chip Antenna + U.FL Connector
- Support for Antenna Diversity
- Maximum Wi-Fi transmit (Tx) power is 18 dBm
- Best Wi-Fi Receiver (Rx) sensitivity is -97 dBm
- Single power supply operation, 3.3V DC
- Drivers available for Linux
- Support for SDIO and USB host interfaces
- RF Calibration Data and MAC addresses are stored in onboard OTP memory
- Optimized RF and electrical design for excellent performance
- Global certifications: FCC, IC, CE
- Available in industrial (-40℃ to +85℃), extended (-30℃ to +85℃) and commercial (0℃ to +70℃) operating temperature variants
Block Diagram
Certifications
- FCC
- IC
- CE
Applications
- IoT (Internet of Things)
- IIoT (Industrial IoT) / M2M (Machine-to-Machine)
- Imaging platforms (printer, digital camera)
- Internet enabled consumer devices
- Video streaming (DTV, DVD/Blu-ray players)
- Video conferencing, Vo-Fi (Voice over Wi-Fi)
- Wi-Fi enabled security cameras
- Home audio/video system
- Automotive aftermarket
- Warehousing and logistics handhelds
- Medical imaging and monitoring equipment
- Gaming platforms
- Mobile routers (Mi-Fi)
- Smart homes
- Smart energy
Specifications
| Wi-Fi IEEE 802.11: | b/g/n, Single-Band (2.4GHz) |
| Available Channels: | Channels 1-13 |
| Channel Bandwidth: | 20 MHz |
| 802.11b Data Rates: | DSSS Modulation: 1 and 2 Mbps CCK Modulation: 5.5 and 11 Mbps |
| 802.11g Data Rates: | OFDM Modulation: 6, 9, 12, 18, 24, 36, 48 and 54 Mbps |
| 802.11n Data Rates: | MCS0-MCS7 (up to 72.2 Mbps) |
| Other 802.11 Features: | 802.11d/e/h/i/k/r/w |
| Maximum Transmit Power: | 18 dBm |
| Receive Sensitivity: | -97 dBm (PER < 8%) |
Kits
Evaluation Kit
Part Ordering: WM825B00-EVK3
The WM825B00 Evaluation kit is a single-band Wi-Fi evaluation platform for the WM825B00 802.11b/g/n WLAN module. This WM825B00 wireless LAN module along with other supporting passive components is mounted on the Evaluation board which is designed as SD card adapter to directly insert into various Microprocessor development platforms or Laptops without any extra connectors. This board is designed to evaluate both SDIO and USB host interfaces. It was used for performing FCC, CE and IC certification and the same Wi-Fi evaluation board can be used to perform the RF tests for any regional certifications like TELEC, KCC, Anatel, etc. The Kit comes with Single-Band (2.4GHz) IEEE 802.11 b/g/n Wi-Fi module Evaluation Board, a Micro USB to USB cable and a 2.4 GHz Rubber Duck Antenna with u.Fl connector cable. A complete software driver support for Linux and all related collaterals will help the user to evaluate this hosted Wi-Fi module and integrate into their end system with substantial reduction in their RND efforts, resources, budget and supports faster time to market.
Development Kit
Part Ordering: WM825B00-DVK3
The WM825B00 Development kit (WM825B00-DVK3) is a plug and play system. It enables customer to evaluate, integrate and develop software for their end system. The Kit comes with WM825B00 Evaluation board, i.MX6 development platform, all necessary accessories and tools. The related collateral explains one click demo program and other sample programs which customer can leverage to their end applications.
Drivers & Documentation
| Particulars | File | Version | Size | Last Updated |
|---|---|---|---|---|
| Product Brief |  WM825B00_Product_Brief.pdf |
1.0 | 607 KB | 12/14/2016 |
| Data Sheet | WM825B00_Datasheet.pdf |
0.6 | 1.5 MB | 12/14/2016 |
| Evaluation Kit Flyer | WM825B00-EVK3_Flyer.pdf |
1.0 | 717 KB | 12/14/2016 |
| Software User Guide | WM825B00_Software_UserGuide.pdf |
0.02 | 1.26 MB | 12/14/2016 |
| Hardware Integration Guide | WM825B00_Hardware_Integration_Guide.pdf |
0.01 | 1.43 MB | 12/14/2016 |
| Drivers |  WM825B00.LNX.PROD.1.0.0.zip |
1.0.0 | 2.85 MB | 12/14/2016 |
Ordering
| Part Order Number | Description | Antenna | Operating Temperature | Packaging Type | Buy from Distributor |
|---|---|---|---|---|---|
| WM825B00-I3QT | Module | Chip + u.Fl | (-40°C to +85°C) | Tray | Buy Now |
| WM825B00-E3QT | Module | Chip + u.Fl | (-30°C to +85°C) | Tray | Buy Now |
| WM825B00-C3QT | Module | Chip + u.Fl | (0°C to +70°C) | Tray | Buy Now |
| WM825B00-I3QR | Module | Chip + u.Fl | (-40°C to +85°C) | Reel | Buy Now |
| WM825B00-E3QR | Module | Chip + u.Fl | (-30°C to +85°C) | Reel | Buy Now |
| WM825B00-C3QR | Module | Chip + u.Fl | (0°C to +70°C) | Reel | Buy Now |
| WM825B00-EVK3 | WM825B00-I3 Module on Evaluation Kit | Chip + u.Fl + Rubber Duck with u.Fl connector cable | (-40°C to +85°C) | Kit | Buy Now |
| WM825B00-DVK3 | WM825B00-EVK3 and i.MX6 Development Platform with all needed Software for application development | Chip + u.Fl + Rubber Duck with u.Fl connector cable | (-40°C to +85°C) | Kit | Buy Now |